All in One Controller
LED Sending Card/Box
LED Receiving Card
ASYNCHRONOUSI MULTI-MEDIA PLAYER
HUB Card
Control System Accessories
Universal Video Processor
4K LED Video Processor
8K LED Video Processor
Video Splicer
Video Splitter
ConsolelSwitcher
I = 1A-10A
U = 3.8VDC
Common Cathode
PFC Power Supply
Dual Outputs Series
DC — DC Series
High Line Input Series
INDOOR LED SCREEN
OUTDOOR LED SCREEN
CREATIVE & CUSTOMIZED LED DISPLAY
INDOOR LED MODULE
OUTDOOR LED MODULE
CUSTOMIZED LED MODULE
Customized Cabinet | Structure
Maintenance Tool
Power Distribution Box
Diagnostic Tools
OTHERS
Data & Power Cable
Cooling Fan
Flight Case
2025 Market Trends: MIP Technology Gains Momentum While COB Continues Cost Reduction
At the Taiwan Healthcare Expo recently held in Taipei, two major LED packaging technologies—MIP (Mini LED in Package) and COB (Chip-on-Board)—were highlighted for their advancements in 2024. Both technologies have demonstrated distinct advantages in different market segments. MIP, known for its compact size, cost-effectiveness, and high performance, has secured a strong position in the direct-view Mini LED market. Meanwhile, COB, valued for its reliability and uniform brightness, has found widespread applications in commercial and household displays. As technology and market demand evolve, 2025 is expected to mark a clear development trajectory for both technologies. COB will continue its path of cost reduction and efficiency improvement, while MIP, leveraging its high integration and innovative capabilities, is set to scale up production and drive new breakthroughs in the LED display industry.
MIP Expands Production Capacity and Market Adoption
Since 2024, MIP technology has rapidly gained traction in China’s fine-pitch LED market, with increasing applications and revenue growth. Leading upstream LED manufacturers—including BOE, Kinglight, NationStar, and Xinying Optoelectronics—along with major downstream display manufacturers such as Leyard, Unilumin, Absen, and AOTO, have all ramped up investments in MIP technology. The transition from R&D to commercialization is evident as more companies launch MIP-based products.
A key factor driving MIP’s adoption is its large-scale production expansion, which is expected to result in significant cost reductions. Industry forecasts indicate that even in a conservative scenario, MIP product costs could drop by approximately 30% in 2025 due to economies of scale and supply chain optimization. When compared to COB, MIP’s cost advantage is expected to increase further as production volumes grow, potentially reversing the cost gap in some product categories. Historical data suggests that COB’s market breakthrough occurred in late 2022, primarily due to large-scale production leading to cost reductions. MIP, with its faster iteration speed, is anticipated to follow a similar trajectory at an accelerated pace. Therefore, MIP’s market expansion in 2025 is projected to at least double, with even greater growth potential.
Several major companies have already planned substantial MIP production capacity expansions. For instance:
Unilumin plans to increase MIP production capacity to 6,000KK/month by the end of 2024.
Leyard aims to expand its MIP packaging capacity to 4,000KK/month.
Hubei Aimap Optoelectronics targets a production capacity of 5,000KK/month by the end of 2025.
As production scales up, MIP’s unit cost will decrease significantly, enhancing its competitiveness in high-end display markets. Additionally, the rapid development of MIP technology is expected to accelerate Micro LED adoption. By 2025, the market share of Micro LED is projected to rise significantly, driven by new technological advancements, growing market demand, and lower production costs. MIP technology facilitates the transition of sub-P2.5 fine-pitch LED displays into the Micro LED era, further reducing production costs and broadening market reach. The industry consensus is clear: winning the Micro LED market is key to securing the future of direct-view LED displays, prompting industry players to prioritize Micro LED adoption.
COB: Cost Reduction and Market Competition Intensify
While MIP gains momentum, COB technology continues its expansion and penetration in 2024. Industry data shows that leading COB manufacturers such as MLS Optoelectronics and Zhongqi Optoelectronics have maintained dominant positions in production capacity and shipments. For example:
MLS Optoelectronics increased its monthly COB production capacity from 10,000 square meters in 2023 to 20,000 square meters in 2024, making it the world’s largest COB manufacturer.
Zhongqi Optoelectronics operated at full capacity throughout 2024, reaching a monthly production capacity of 10,000 square meters and excelling in P1.0 and below COB applications.
COB technology remains a cost-effective and high-performance solution in the LED display industry. By directly mounting bare LED chips onto substrates and encapsulating them, COB offers superior light efficiency, better heat dissipation, and lower production costs compared to traditional SMD packaging. These advantages make COB particularly suitable for high-density, fine-pitch LED displays. As pixel pitch continues to shrink, demand for high-resolution and uniform displays increases, further reinforcing COB’s market position.
Currently, COB applications focus on P1.2 displays, with two key development directions:
Expanding to P1.5 and above to leverage economies of scale.
Advancing into sub-P0.9 markets to capture higher profit margins.
While SMD technology still dominates the P1.5 market due to its cost-effectiveness, COB is steadily increasing its penetration rate. In 2024, COB demonstrated strong competitiveness across multiple key aspects, including innovation, production capacity, supply chain maturity, cost efficiency, and market acceptance. However, an industry-wide oversupply is expected to persist in 2025, intensifying competition. Key challenges for COB in the coming years include:
Balancing cost-effectiveness in large-pitch applications
Expanding market adoption in sub-P1.0 displays
Navigating competitive pressures from emerging technologies
MIP vs. COB: Future Market Outlook
As MIP technology rapidly evolves, its increasing production capacity and cost reductions are reshaping the competitive landscape of the LED display market. MIP’s advantages are particularly evident in the Micro LED sector, where it enhances production efficiency by reducing mounting difficulties and improving process compatibility. Furthermore, MIP seamlessly integrates with traditional SMD processes, PCB substrates, and even COB-based end-product designs, giving it broad application potential.
Looking ahead, both MIP and COB technologies will continue to advance, but MIP’s growth rate and market potential are expected to outpace COB. As costs decrease and technology improves, MIP could capture a larger market share in the LED display industry. Additionally, the rise of AM (Active Matrix) driving technology will further accelerate MIP adoption, driving the direct-view LED industry into a new phase of development. While COB remains a significant player in the market, it must continuously innovate to maintain its competitive edge against emerging technologies like MIP.
Conclusion
The LED display industry in 2025 presents both opportunities and challenges. As technology progresses and market demand grows, the industry will continue to expand, creating new possibilities for innovation. MIP and COB packaging technologies will play pivotal roles in this transformation. Whether through MIP’s rapid commercialization and cost reduction or COB’s continuous efficiency improvements, both technologies will contribute to the industry’s evolution. To stay ahead, industry players must closely monitor technological advancements and market trends, adapting their strategies accordingly to seize emerging opportunities and achieve sustainable growth.
